'World-class' electronics hub gets £160 million lift

Plans for a “world-class” 300-job electronics development hub have received a £160 million boost.

The National Advanced Semiconductor Packaging and Integration Centre has been backed by the Government.

Bosses say the “European-first” venture will add £800 million of business revenue by boosting semiconductor advances across areas including artificial intelligence and photonics, and reducing packaging lead times “from months to days”.  

Led by the National Manufacturing Institute Scotland, the centre will form part of the University of Strathclyde’s Advanced Net Zero Innovation Centre, in Renfrewshire.

Professor Matt Boyle, director of electrification at the National Manufacturing Institute Scotland, said: “We are building a world-class capability, positioning the region at the forefront of advanced semiconductor development.

“There is no other facility in the UK that offers the level of support and access to technology we are planning.

“This new national resource will be key to enhancing the UK’s position in a growing global market, nurturing businesses and enabling them to scale.

“This is a very exciting moment.

“With fresh momentum and investment, we have the opportunity to put Scotland back on the global map for advanced packaging.”

Professor Sir Jim McDonald, principal and vice-chancellor of the University of Strathclyde, and chair of the National Manufacturing Institute Scotland board, added: “This is a strategically important capability for the UK.

“We are helping to build the skills, infrastructure and expertise required to secure the UK’s future as a global leader in advanced manufacturing.”

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